microfill™ lvf 3 acid copper from dupont dow rhom hass company

microfill™ lvf 3 acid copper is designed to offer exceptional blind microvia filling performance, and is specifically formulated for use with insoluble anodes and direct current (dc) rectification. formulated to operate over a broad range of operating conditions, the bath offers end users with outstanding production flexibility in either panel or pattern plate operation.
 

advantages:

• excellent blind microvia fill with lower copper surface thickness
• bright, highly ductile, leveled deposit
• dc process with insoluble anodes for simple operation
• easily analyzed and controlled by conventional cvs
• designed for use in both pattern and panel plate applications
• tunable process for specific end user requirements
   

download presentation   english only 
read technical article   english only
 

read technology for through hole filling 
microfill™ thf electrolytic copper
 

dielectric thickness: 110 µm
plating thickness: 12 µm

 

酸性(xìng)鍍銅中(zhōng)間體相關鏈(liàn)接：

垂直連續電(diàn)鍍（vcp）高(gāo)tp值酸(suān)性鍍銅光澤劑(jì)用電鍍中(zhōng)間(jiān)體： unisun.cc/news/170.html
 

pcb/fpc用高tp值vcp酸性鍍(dù)銅光(guāng)亮劑(jì)中間(jiān)體産(chǎn)品介紹： unisun.cc/news/30.html
 

2021年度填孔鍍(dù)銅(tóng)——印刷線路闆(pǎn)（pcb，fpc）酸(suān)性(xìng)填孔(kǒng)鍍銅中(zhōng)間體： unisun.cc/news/283.html

 

2021年(nián)國際表(biǎo)面(miàn)處(chù)理(lǐ)展電(diàn)子展廳：

深圳市同(tóng)泰化學技術(shù)有限公司(sī)參加了(le)2021年7月26-28日(rì)在廣(guǎng)州保(bǎo)利世(shì)貿博覽館(guǎn)舉辦的第(dì)十四屆廣(guǎng)州國(guó)際(jì)表(biǎo)面處(chù)理、電鍍、塗裝展(zhǎn)覽會，誠邀您莅(lì)臨同(tóng)泰化(huà)學電(diàn)子展(zhǎn)廳(tīng)參觀指導！電(diàn)子(zǐ)展廳鏈(liàn)接(jiē)：unisun.cc/news/316.html 。