copper gleam™ hs-200 electrolytic copper from dupont dow rhom hass company

the copper gleam™ hs-200 bath is a full bright acid copper plating process specifically formulated for use in conveyorized plating equipment with insoluble anode. formulated for high current density plating, the process is capable of producing uniform, bright deposits of high ductility and tensile strength in accelerated plating times.
 

key benefits:

• high throwing power at accelerate plating rate
• bright uniform deposits
• exceptional physical properties
• complete analytical control
   

酸性(xìng)鍍銅(tóng)中(zhōng)間體相關鏈(liàn)接：

垂直連續電(diàn)鍍（vcp）高tp值酸性鍍銅光(guāng)澤(zé)劑(jì)用電鍍中間體： unisun.cc/news/170.html
 

pcb/fpc用高(gāo)tp值vcp酸性鍍(dù)銅光(guāng)亮劑中間體産品介(jiè)紹： unisun.cc/news/30.html
 

2021年(nián)度填(tián)孔鍍銅——印刷線(xiàn)路闆(pǎn)（pcb，fpc）酸(suān)性填孔(kǒng)鍍(dù)銅中間體： unisun.cc/news/283.html

 

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