microfill™ lvf iv acid copper from dupont dow rhom hass company

2022-03-07 10:01

  • microfill™ lvf iv acid copper

advanced flip-chip packages demand higher functionality in increasingly fine pitch substrates, resulting in the need to reliably create fine metal features. dupont™ microfill™ lvf iv acid copper plating process has been designed to meet these needs, using insoluble anodes and direct current (dc) plating in electroplating systems designed for substrate manufacturing.
 

  • designed for pattern plate capability, with excellent laser micro-via fill and pattern plate uniformity of flip-chip substrates.
  • dc process with insoluble anodes to minimize idle-time effects.
  • bright, highly leveled, ductile deposit
  • easily analyzed and controlled by conventional cvs techniques.
  • highly tunable process for different product requirements.
     

read technical paper

next generation copper pattern plating for ic package application

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excellent viafill performance across the working panel in isolated and dense areas.

 

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